21st International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

To cater for the technology trends, the theme of IMPACT 2026 highlights “Energy-Efficient AI: From Computing to Systems and Applications.”,covers scope from packaging to PCB, with issues on Advanced Packaging Technologies, Power Electronics Packaging, Interconnections & Nanotechnolog, Design, Modeling, AI/Machine Learning Applications, and Testing, Advanced Materials, Automatic Process & Assembly,Emerging Systems Packaging Technologies, Sustainable Technologies & Systems, Sustainable Materials and Technology, Smart Manufacturing, Inspection and Testing, HDI PCB, IC Substrate and FPC Technology, Advanced and Emerging Technology.

With technical sponsorship from IEEE, this event anticipates that its proceedings will be indexed in leading databases such as Scopus, Web of Science (WoS), Ei Compendex, DBLP, and Google Scholar.