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Fifth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)
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This symposium features world-class experts representing a far-reaching range of disciplinary perspectives to advance the development of future 3D power electronics systems. The Symposium encompasses additive, embedded, co-designed, and integrated packaging technologies with sessions that address mechanical, materials, reliability, and manufacturability issues using small, smart, power-dense components, and modules.
Fifth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) is technically sponsored by IEEE. The proceedings of this conference are likely to be indexed in renowned databases such as Scopus, Web of Science (WoS), Google Scholar, and many others.