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IEEE CPMT Symposium Japan (ICSJ)
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This symposium pictures the future state of the electronics packaging which impacts the infrastructures of 5G and B5G. The symposium also tries to predict where the packaging technology is heading. The symposium will emphasize the following main topics: Photonics, Advanced Packaging, Power Electronics, Automotive, Bioelectronics, and Healthcare to discuss about the technologies on Electronics Packaging for Advanced Heterogeneous Integration.
IEEE CPMT Symposium Japan (ICSJ) is technically sponsored by IEEE. The conference proceedings are likely to be indexed in Scopus and Web of Science.
