25th European Microelectronics and Packaging Conference & Exhibition (EMPC)

The EMPC 2025 will focus on industrial needs, trends and solutions, and academic R&D. The event will bring together researchers, innovators, technologists, business and marketing managers with an interest in microelectronics and photonics packaging, enabling communication, education and interaction focused on developments of technologies of the present and for the future, including: 2.5D and 3D IC Integration, SMT, System-in-Package, CoB, PoP and FC-Assembly, Embedding, Wafer Level Packaging, Encapsulation, Printed Electronics, Flexible Electronics, MEMS and NEMS, Photonics, Power Electronics, Substrate Technologies, Advanced Materials, Emerging Technologies, RF and High-temperature Electronics, Heterogeneous Integration, TSVs, Material Characterisation, Thermal Management, Interconnects, New Solder Alloys, Qualification, Reliability, Failure Analysis and Test, Thermal-Mechanical, Multi-physics and Multi-scale Modelling and Simulation.

25th European Microelectronics and Packaging Conference & Exhibition (EMPC) is technically sponsored by IEEE. The conference proceedings are likely to be indexed in Scopus and Web of Science.