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IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
323 323 people viewed this event.
The scope is electrical package design and analysis, including modelling, simulation, fabrication and characterization.
IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) is technically sponsored by IEEE. The proceedings of this event are likely to be listed in prestigious databases such as Scopus, Web of Science (WoS), Ei Compendex, DBLP, Google Scholar, and many others.