IEEE CPMT Symposium Japan (ICSJ)
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This symposium pictures the future state of the electronics packaging which impacts the infrastructures of B5G and 6G. This symposium also tries to predict where the packaging technology is heading. The symposium will emphasize the following main topics: Photonics, Advanced Packaging, Signal and power integrity, Power Electronics, Automotive Electronics, Interconnections and Bioelectronics to discuss about the technologies on Electronics Packaging for AI / Data center and its Utilization Technology.
With technical sponsorship from IEEE, this event anticipates that its proceedings will be indexed in leading databases such as Scopus, Web of Science (WoS), Ei Compendex, DBLP, and Google Scholar.