IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP)

This symposium focuses on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, stress levels, mechanisms, testing schemes, accelerated testing, and environmental stresses. IT brings together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability-related aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.

With technical sponsorship from IEEE, this event anticipates that its proceedings will be indexed in leading databases such as Scopus, Web of Science (WoS), Ei Compendex, DBLP, and Google Scholar.