a. Targets academia ( students, researchers, faculty) & b. Indian and Global Industry engaged in Semiconductor design, fabrication, OSAT, ATMP, packaging domains for both work force development and sector manufacturing/ design industry enablement Primary focus is academia and secondary focus is industry. Geographically, attendance is expected to have a stronger mix from North India/ Delhi- NCR Region. Following Tracks are planned for the EPT conference @ Manav Rachana, focusing on emerging trends, technologies, and challenges in electronics packaging: 1. Advanced Packaging Technologies 2. Materials and Processes for Packaging 3. Reliability and Testing 4. Power and RF Packaging 5. Emerging Applications 6. Sustainable and Green Packaging 7. Advanced Interconnects and Integration 8. Thermal and Mechanical Challenges 9. AI, ML, and Digital Twin in Packaging 10. Automation and Robotics in Packaging

1st International Electronics & Packaging Technologies Conference: Bridging Skills & Innovation for India’s Industry (EPT India) is technically sponsored by IEEE. The proceedings of the conference will be submitted for inclusion in prestigious databases such as Scopus, Web of Science (WoS), Ei Compendex, DBLP, Google Scholar, and many others.