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2023 15th International Congress Mechatronic Integration Discourse (MID)
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Since 1994, the Research Association 3-D MID biennially organizes the International Congress Molded Interconnect Devices in order to support the further development of the technology by offering a platform for the global transfer of knowledge and information. With about 200 participants from all over the world this international recognized conference is the worlds leading event in the field of MID.