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2023 IEEE CPMT Symposium Japan (ICSJ)
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This symposium pictures the future state of the electronics packaging which impacts the infrastructures of datacenter, network and edge equipment. The symposium also tries to predict where the packaging technology is heading. The symposium will emphasize the following main topics: Photonics, Advanced Packaging, Power Electronics, Automotive, Bioelectronics, and Healthcare to discuss about the technologies on Electronics Packaging especially in terms of the evolution of chiplet technology.