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2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
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DTIP’2024 will be the 26th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed. After the successful 2023 edition back in in-person mode … hopefully leaving behind the sanitary crisis … the 2024 edition will take place in the city of Dresden, Germany. We look forward to meeting you in Dresden…