To cater for the technology trends, the theme of IMPACT 2025 highlights ” Energy-Efficient AI: From Cloud to the Edge “,covers scope from packaging to PCB, with issues on Advanced Packaging Technologies, Power Electronics Packaging, Interconnections & Nanotechnolog, Design, Modeling, AI/Machine Learning Applications, and Testing, Advanced Materials, Automatic Process & Assembly,Emerging Systems Packaging Technologies, Sustainable Technologies & Systems, Sustainable Materials and Technology, Smart Manufacturing, Inspection and Testing, HDI PCB, IC Substrate and FPC Technology, Advanced and Emerging Technology.

20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) is technically sponsored by IEEE. The proceedings of the conference will be submitted for inclusion in prestigious databases such as Scopus, Web of Science (WoS), Ei Compendex, DBLP, Google Scholar, and many others.