27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) will be held in Warsaw, Poland on 19-04-2026.

27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) is technically sponsored by IEEE. The proceedings  of this event are likely to be indexed in  prominent databases such as Scopus, Web of Science (WoS), Ei Compendex, DBLP, Google Scholar, and many others.