The topics of this conference cover reliability, and failure analysis of electronic devices and systems, specifically: A) techniques and methodologies for assessing and enhancing the reliability of electronic devices and systems. B) failure mechanisms specific to silicon-based and nanoelectronic technologies. C) advances in failure analysis techniques and defect characterization. D) reliability of microwave and compound semiconductor devices, including wide bandgap materials such as GaN and SiC. E) packaging and assembly reliability, with an emphasis on electrical and mechanical modeling and simulation. F) is dedicated to power devices and microelectronic systems. G) reliability of photonic and optoelectronic components, encompassing solar cells, display technologies, and organic electronics. H) reliability of MEMS, MOEMS, and emerging nano-sensors and bio-electronic devices. I) reliability under extreme environmental conditions.

European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) is technically sponsored by IEEE. The proceedings  of this event are likely to be indexed in  prominent databases such as Scopus, Web of Science (WoS), Ei Compendex, DBLP, Google Scholar, and many others.