IEEE 11th Electronics System-Integration Technology Conference (ESTC)
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This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-art and future trends in electronics packaging and integration technologies.
IEEE 11th Electronics System-Integration Technology Conference (ESTC) is technically sponsored by IEEE. The proceedings of the conference will be submitted for inclusion in prestigious databases such as Scopus, Web of Science (WoS), Ei Compendex, DBLP, Google Scholar, and many others.