EPTC 2025 will feature keynotes, technical sessions, short courses, panels, workshops, invited speakers, an exhibition, social and networking activities. It aims to provide a comprehensive coverage of development in all areas of electronics packaging technology from design to manufacturing and operation. It is a major forum for the exchange of knowledge in electronics packaging and provides opportunities to network and meet leading experts.

IEEE 27th Electronics Packaging Technology Conference (EPTC) is technically sponsored by IEEE. The proceedings of the conference will be submitted for inclusion in prestigious databases such as Scopus, Web of Science (WoS), Ei Compendex, DBLP, Google Scholar, and many others.