IEEE 28th Electronics Packaging Technology Conference (EPTC)

The 28th IEEE Electronics Packaging Technology Conference (EPTC2026) is an international event organized by the IEEE RS/EPS/EDS Singapore Joint Chapter and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region. It aims to cover the complete spectrum of electronics packaging technology. Topics include components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation, and AI. EPTC2026 will feature keynotes, technical sessions, invited talks, panels, workshops, exhibitions, and networking activities.

With technical sponsorship from IEEE, this event anticipates that its proceedings will be indexed in leading databases such as Scopus, Web of Science (WoS), Ei Compendex, DBLP, and Google Scholar.