Characterization, modeling and design for signal and power integrity of electronic systems. Modeling, simulation and measurement of electrical interconnect performance at chip, board and package levels. Innovative CAD concepts and algorithms. Applications to computing devices, mobile devices, automotive/aerospace. Optical interconnection technology on component and board level.

IEEE 30th Workshop on Signal and Power Integrity (SPI) is technically sponsored by IEEE. The proceedings  of this event are likely to be indexed in  prominent databases such as Scopus, Web of Science (WoS), Ei Compendex, DBLP, Google Scholar, and many others.