IEEE 39th International System-on-Chip Conference (SOCC)

System-on-Chip (SoC) and System-in-Package (SiP) devices, comprising digital, analog, optical, RF, and Micro-Electro-Mechanical Systems (MEMS) are foundations of ubiquitous embedded high-performance computing (HPC). Such systems will provide solutions in communication, entertainment, medical and smart mobility technologies. Recent advances in systems, packaging and process technologies are enabling the computation of hundreds of teraflops per chip and chiplet system integration unleashing the massive rise of AI-based edge devices, various accelerators, new products and applications. For more than 38 years the IEEE International System-on-Chip Conference (SOCC) has been a premier forum for sharing latest advancements in SoC architectures, systems, logic and circuit design, process technology, test, design tools, and application scenarios. We consequently continue this tradition with the 2026 conference in Heidelberg, Germany.

IEEE 39th International System-on-Chip Conference (SOCC) is technically sponsored by IEEE. The proceedings  will be submitted for inclusion in Web of Science (WoS), Scopus, Ei Compendex, DBLP, Google Scholar, and many others databases.