IEEE 41st International Electronics Manufacturing Technology (IEMT)

Advanced and Emerging Packaging & Integration,2D/3D and Heterogeneous Integration,System-in-Package (SiP) and Chiplets,Wafer-Level and Fan-Out Packaging,Panel-Level Packaging,Advanced Assembly Technologies,Power Electronics and Rugged Packaging Technologies,Packaging and Integration for Power Modules,Thermal Management,Reliability and Testing,Wide-Bandgap Devices (SiC, GaN),Applications in Automotive and Industrial Systems,AI, Edge Computing, and High-Performance Electronics,Integration and Co-Design Challenges,Thermal Management and Reliability,Testing and Validation,Applications in Autonomous and Intelligent Systems,Substrates, Interposers, and Advanced PCB Technologies,Organic, Glass, and Silicon Interposers,System/Package/PCB Co-Design,Materials, Processes, and Sustainability,Materials for Harsh Environments,Interconnections, Modeling, Reliability, and Manufacturing,Smart Manufacturing and Advanced Metrology,AI/ML-Enabled Packaging Equipment,Characterization and Failure Analysis

IEEE 41st International Electronics Manufacturing Technology (IEMT) is technically sponsored by IEEE. The proceedings  will be submitted for inclusion in Web of Science (WoS), Scopus, Ei Compendex, DBLP, Google Scholar, and many others databases.