IEEE/ACM International Conference on Technical Debt (TechDebt)
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The International Conference on Technical Debt is the flagship conference dedicated to discussing how to identify, address, and manage technical debt in software projects. This premier event unites leading researchers and practitioners in software engineering to explore diverse strategies for managing various forms of technical debt, share experiences and best practices, and identify the most pressing challenges faced by both industry and academia.
IEEE/ACM International Conference on Technical Debt (TechDebt) is technically sponsored by IEEE. The proceedings will be submitted for inclusion in Web of Science (WoS), Scopus, Ei Compendex, DBLP, Google Scholar, and many others databases.