This symposium pictures the future state of the electronics packaging which impacts the infrastructures of B5G and 6G. This symposium also tries to predict where the packaging technology is heading. The symposium will emphasize the following main topics: Photonics, Advanced Packaging, Power Electronics, Automotive Electronics and Bioelectronics to discuss about the technologies on Electronics Packaging for Digital Twin.

IEEE CPMT Symposium Japan (ICSJ) is technically sponsored by IEEE. The proceedings  of this event are likely to be listed in  prestigious databases such as Scopus, Web of Science (WoS), Ei Compendex, DBLP, Google Scholar, and many others.