IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
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Advances in electrical design, modeling, simulation, and measurement at the chip, package, and system levels.
IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) is technically sponsored by IEEE. The proceedings will be submitted for inclusion in Web of Science (WoS), Scopus, Ei Compendex, DBLP, Google Scholar, and many others databases.