IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE 2026)
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Researchers will gather for IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE 2026) in the city of Phoenix (United States) 27 October 2026 to 29 October 2026.
Critical Milestone: Authors are requested to complete their submission by the target date of July 20, 2026. Failure to meet this date may result in exclusion from the 2026 index.
Proceedings indexed by: Ieee Xplore