IEEE Physical Assurance and Inspection of Electronics
This is to inform you that the “IEEE International Conference on Physical Assurance and Inspection on Electronics” (PAINE), is to be held “in-person” from November 12-14, 2024 in Huntsville, AL. PAINE is supported by the “Reliability Society” and accepted papers will be published in IEEE Xplore after peer review by the PAINE TPC.
PAINE offers an exciting venue to researchers and practitioners in the field of Hardware Security and Trust who research and develop physical assurance and analysis. PAINE brings together experts from government, instrumentation, original component manufacturers (OCMs), original equipment manufacturers (OEMs), and academic researchers together to share ideas and solutions to make electronic devices and systems safe and secure.