COOL Chips is an International Symposium initiated in 1998 to present advancement of low power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. Contributions are solicited in the following areas: – Low Power-High Performance Processors for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical,Healthcare, and Biometrics. – Novel Architectures and Schemes for Single Core, Multi/Many-Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration. – Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.

IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL CHIPS) is technically sponsored by IEEE. The conference proceedings are likely to be indexed in databases such as Scopus, Web of Science (WoS), Google Scholar, and others.